semiconductor

A Migration Feasibility Study Can Turn an Uncertain Re-Design into a Measurable Engineering Project

semiconductor

A Migration Feasibility Study Can Turn an Uncertain Re-Design into a Measurable Engineering Project

Source: https://semiwiki.com/semiconductor-services/in2fab/374736-migration-feasibility-study/ Moving semiconductor IP to a new process technology is often treated as a redesign problem. For analog and mixed-signal designs, however, starting again from the schematic can overlook an asset: the engineering knowledge embedded in the existing physical layout. 반도체 IP를 새로운 공정

By Jeongwoo Heo
Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

semiconductor

Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

Source: https://semiwiki.com/semiconductor-manufacturers/teradyne/374603-teradyne-unveils-magnum-e2-for-the-next-wave-of-ai-memory/ Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and

By Jeongwoo Heo
VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives

semiconductor

VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives

Source: https://semiwiki.com/semiconductor-manufacturers/vsora/374585-vsoras-sandra-rivera-on-the-inference-era-demand-is-real-but-not-everyone-survives/ Sandra Rivera, Chair of VSORA, joined Bloomberg’s The Close in July for an interview on the current state of AI. What follows is a summary of that conversation. VSORA의 의장인 산드라 리베라(Sandra Rivera)는 지난 7월 블룸버그의 ‘더 클로즈(The Close)

By Jeongwoo Heo
Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs

semiconductor

Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs

Source: https://semiwiki.com/semiconductor-manufacturers/intel/374536-intels-open-software-blueprint-why-production-ai-needs-more-than-gpus/ Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs,

By Jeongwoo Heo
Chips&Media targets AI memory bottlenecks with new compression IP

semiconductor

Chips&Media targets AI memory bottlenecks with new compression IP

Source: https://semiwiki.com/ip/chipsmedia/374498-chipsmedia-targets-ai-memory-bottlenecks-with-new-compression-ip/ Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an

By Jeongwoo Heo
Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP

semiconductor

Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP

Source: https://semiwiki.com/artificial-intelligence/374757-overcoming-the-edge-ai-power-wall-with-low-voltage-foundation-ip/ As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning

By Jeongwoo Heo
ChipAgents and NVIDIA Put Autonomous Chip Design to the Test

semiconductor

ChipAgents and NVIDIA Put Autonomous Chip Design to the Test

Source: https://semiwiki.com/eda/374909-chipagents-and-nvidia-put-autonomous-chip-design-to-the-test/ ChipAgents has introduced Build-A-Chip-Bench, a benchmark developed with NVIDIA to evaluate whether AI agents can complete digital chip design tasks from specification through physical implementation. The initiative measures progress beyond generating hardware code, asking whether autonomous systems can deliver verified layouts while satisfying interconnected

By Jeongwoo Heo
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036

semiconductor

Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036

Source: https://semiwiki.com/lithography/374764-hyper-na-euv-the-next-frontier-in-chipmaking-could-arrive-in-2036/ Hyper-NA EUV could be ready around 2036, based on the roughly ten-year development outlook reported by ASML and Zeiss engineers in October 2026. ASML과 자이스(Zeiss) 엔지니어들이 2026년 10월에 보고한 약 10년의 개발 전망을 바탕으로 할 때, 하이퍼-NA(Hyper-NA) EUV는 2036년경에 준비될 수 있습니다.

By Jeongwoo Heo
TSMC 2026 OIP Ecosystem Forum Summary

semiconductor

TSMC 2026 OIP Ecosystem Forum Summary

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/374104-tsmc-2026-oip-ecosystem-forum-summary/ TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner

By Jeongwoo Heo