SemiWiki

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

semiconductor

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

Source: https://semiwiki.com/artificial-intelligence/373920-the-intelligence-revolution-tsmcs-oip-ecosystem-forges-the-path-to-trillion-transistor-ai-systems/ At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through artificial

By Jeongwoo Heo
Why ASML Is Racing to Build 110 EUV Machines

semiconductor

Why ASML Is Racing to Build 110 EUV Machines

Source: https://semiwiki.com/lithography/373646-why-asml-is-racing-to-build-110-euv-machines/ ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production increase

By Jeongwoo Heo
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

semiconductor

Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/371790-comparison-of-tsmc-cowos-s-cowos-r-and-cowos-l/ Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing systems, where processors need enormous

By Jeongwoo Heo
Broadcom’s AI Engine Shifts Into Overdrive

semiconductor

Broadcom’s AI Engine Shifts Into Overdrive

Source: https://semiwiki.com/semiconductor-manufacturers/373540-broadcoms-ai-engine-shifts-into-overdrive/ Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion made AI silicon

By Jeongwoo Heo
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

semiconductor

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/373574-tsmcs-cowos-capacity-to-double-by-2028-and-rivals-will-still-win-orders/ TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the

By Jeongwoo Heo
Arm targets the agentic AI era with new edge, cloud and robotics platforms

semiconductor

Arm targets the agentic AI era with new edge, cloud and robotics platforms

Source: https://semiwiki.com/ip/373258-arm-targets-the-agentic-ai-era-with-new-edge-cloud-and-robotics-platforms/ Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives

By Jeongwoo Heo
The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

semiconductor

The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

Source: https://semiwiki.com/semiconductor-manufacturers/373587-the-state-of-the-u-s-semiconductor-manufacturing-workforce-2026-benchmark-report/ America’s semiconductor workforce is entering a decisive growth period, but employment capacity is not yet keeping pace with investment. New fabrication plants, packaging facilities, and supplier expansions are creating demand for thousands of engineers, technicians, operators, and skilled tradespeople. Whether the United States

By Jeongwoo Heo
Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure

semiconductor

Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure

Source: https://semiwiki.com/artificial-intelligence/373912-beyond-the-accelerator-why-silicon-challengers-must-transition-to-full-system-infrastructure/ The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular caught

By Jeongwoo Heo
Semiconductor Engineering Has a State-Continuity Problem

semiconductor

Semiconductor Engineering Has a State-Continuity Problem

Source: https://semiwiki.com/eda/373472-semiconductor-engineering-has-a-state-continuity-problem/ Product realization depends not only on reaching the next engineering state, but on preserving the relationships between states from intent through qualification, release, and lifecycle learning. 제품 실현은 다음 엔지니어링 단계에 도달하는 것뿐만 아니라, 의도에서부터 검증, 출시, 그리고 라이프사이클 학습에 이르기까지 각 단계 간의

By Jeongwoo Heo