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The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

semiconductor

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

Source: https://semiwiki.com/artificial-intelligence/373920-the-intelligence-revolution-tsmcs-oip-ecosystem-forges-the-path-to-trillion-transistor-ai-systems/ At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through artificial

By Jeongwoo Heo
Why ASML Is Racing to Build 110 EUV Machines

semiconductor

Why ASML Is Racing to Build 110 EUV Machines

Source: https://semiwiki.com/lithography/373646-why-asml-is-racing-to-build-110-euv-machines/ ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production increase

By Jeongwoo Heo
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

semiconductor

Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/371790-comparison-of-tsmc-cowos-s-cowos-r-and-cowos-l/ Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing systems, where processors need enormous

By Jeongwoo Heo
Charbel Haber, Nicolás Jaar and Sary Moussa- ‘Crashing waves…’: A breath-taking electro-acoustic journey which reaches beyond the moment.

music

Charbel Haber, Nicolás Jaar and Sary Moussa- ‘Crashing waves…’: A breath-taking electro-acoustic journey which reaches beyond the moment.

Source: https://www.backseatmafia.com/album-review-charbel-haber-nicolas-jaar-and-sary-moussa-crashing-waves-a-breath-taking-electro-acoustic-journey-which-reaches-beyond-the-moment Disseminating experimental/alternative music from the myriad of vibrant scenes across the SWANA region to the wider world has been Ruptured Music’s generous undertaking for over fifteen years. Its creative source keeps giving and its curational insight keeps providing. Enter amongst the label’

By Jeongwoo Heo
Broadcom’s AI Engine Shifts Into Overdrive

semiconductor

Broadcom’s AI Engine Shifts Into Overdrive

Source: https://semiwiki.com/semiconductor-manufacturers/373540-broadcoms-ai-engine-shifts-into-overdrive/ Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion made AI silicon

By Jeongwoo Heo
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

semiconductor

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/373574-tsmcs-cowos-capacity-to-double-by-2028-and-rivals-will-still-win-orders/ TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the

By Jeongwoo Heo
Arm targets the agentic AI era with new edge, cloud and robotics platforms

semiconductor

Arm targets the agentic AI era with new edge, cloud and robotics platforms

Source: https://semiwiki.com/ip/373258-arm-targets-the-agentic-ai-era-with-new-edge-cloud-and-robotics-platforms/ Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives

By Jeongwoo Heo