semiconductor
Beyond the Die: Verifying the Connected Chip
Source: https://semiwiki.com/eda/siemens-eda/374270-beyond-the-die-verifying-the-connected-chip/ One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology