semiconductor

Who Gets to Move the Recipe? How Autonomous Agents Earn Decision Authority in the Fab

semiconductor

Who Gets to Move the Recipe? How Autonomous Agents Earn Decision Authority in the Fab

Source: https://semiwiki.com/eda/375060-who-gets-to-move-the-recipe-how-autonomous-agents-earn-decision-authority-in-the-fab/ by Ajay Kumar Govindaram 아제이 쿠마르 고빈다람(Ajay Kumar Govindaram) 글 There’s a question I’ve started asking at every agentic AI demo I sit through, and it has a clean answer in every fab on earth: who is allowed to change the

By Jeongwoo Heo
Smoothing the Quantum Path: ASML and Xanadu Target Photon Loss

semiconductor

Smoothing the Quantum Path: ASML and Xanadu Target Photon Loss

Source: https://semiwiki.com/lithography/373533-smoothing-the-quantum-path-asml-and-xanadu-target-photon-loss/ ASML’s decision to collaborate with Xanadu targets one of photonic quantum computing’s most unforgiving engineering constraints: photon loss. The companies will investigate advanced lithography processes for Xanadu’s photonic quantum hardware, focusing on whether tighter patterning control can suppress loss mechanisms and

By Jeongwoo Heo
Sir Arthur C. Clarke Deserves a Nobel Prize

semiconductor

Sir Arthur C. Clarke Deserves a Nobel Prize

Source: https://semiwiki.com/semiconductor-services/silicon-catalyst/375130-sir-arthur-c-clarke-deserves-a-nobel-prize/ By Richard Curtin 리차드 커틴(Richard Curtin) 글 Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”) I’ve been convinced that the Nobel Prize committee needs to consider awarding a posthumous award to Sir Arthur. 실리콘 카탈리스트

By Jeongwoo Heo

semiconductor

Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering

Source: https://semiwiki.com/eda/agentrys/375112-agentrys-shows-the-way-with-agentic-loop-engineering/ At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with AI in the design loop. As reported from the session by ServeTheHome and Tom’s Hardware, OpenAI showed measured block-level wins over a human baseline — 56% on a BF16 multiply, alongside

By Jeongwoo Heo
Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips

semiconductor

Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips

Source: https://semiwiki.com/eda/siemens-eda/374917-siemens-and-nvidia-accelerate-lithography-for-next-generation-ai-chips/ Siemens has announced advances in its collaboration with NVIDIA to accelerate computational lithography, addressing a demanding step in manufacturing advanced AI semiconductors. By integrating NVIDIA’s cuLitho library with Siemens Calibre manufacturing software, the companies aim to make sophisticated photomask optimization practical at

By Jeongwoo Heo
Maskless EUV Lithography: An Alternative to E-Beam

semiconductor

Maskless EUV Lithography: An Alternative to E-Beam

Source: https://semiwiki.com/lithography/373583-maskless-euv-lithography-an-alternative-to-e-beam/ Semiconductor manufacturing depends on lithography: the process of transferring tiny circuit patterns onto a silicon wafer. Conventional extreme-ultraviolet (EUV) lithography projects light with a wavelength of 13.5 nanometers through a reflective optical system, using a custom photomask to define each layer. It can

By Jeongwoo Heo
TSMC’s AI Expansion Signals a Broader Shift in Computing

semiconductor

TSMC’s AI Expansion Signals a Broader Shift in Computing

Source: https://semiwiki.com/semiconductor-manufacturers/tsmc/374950-tsmcs-ai-expansion-signals-a-broader-shift-in-computing/ TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and

By Jeongwoo Heo
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

semiconductor

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Source: https://semiwiki.com/semiconductor-manufacturers/374838-terafabs-single-roof-why-packaging-not-lithography-decides-high-volume/ By Shaurya Seth Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a

By Jeongwoo Heo
Why Semiconductor AI Starts with Data, Not Algorithms

semiconductor

Why Semiconductor AI Starts with Data, Not Algorithms

Source: https://semiwiki.com/semiconductor-manufacturers/374900-why-semiconductor-ai-starts-with-data-not-algorithms/ The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions. 반도체 분야에서 AI가 가져올 다음 단계의 성장은 정교한 모델 그 자체보다는 팹(fab) 및 테스트 데이터를 신뢰할

By Jeongwoo Heo
Why AI Security Starts at the Chip Level

semiconductor

Why AI Security Starts at the Chip Level

Source: https://semiwiki.com/eda/synopsys/374743-why-ai-security-starts-at-the-chip-level/ Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital services. As these systems grow more capable, they also process more sensitive information and depend on increasingly complex hardware. The Synopsys white paper, “Securing AI at

By Jeongwoo Heo
Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score

semiconductor

Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score

Source: https://semiwiki.com/semiconductor-services/flow-accel/374405-delivering-silicon-systems-through-ai-disruption-part-1-writing-the-score/ Score: the written music for an orchestra, with every section’s part laid out on the same page so they play together. In this article, it’s your designed workflows. 총보(Score): 오케스트라를 위한 악보로, 모든 파트의 악보가 한 페이지에 정렬되어 함께 연주할

By Jeongwoo Heo